Mamata Machinery Limited (MAMATA) — Announcement | 18 August 2026 (2 announcements)

Mamata Machinery Limited announced it has filed a patent application in India for its Die and Screw design, the core technology behind RecTech, its recyclable film technology. This filing underscores the company's focus on building breakthrough technologies and securing intellectual property to reinforce its position as a technology-driven player in flexible packaging machinery. The patent application is a strategic move to protect its RecTech innovation, which is central to its sustainable packaging solutions.

Mamata Machinery Limited announced filing a patent application for its Die and Screw Design technology, a core component of its Recyclable Film Technology (RecTech), to protect its intellectual property in India.